Übersicht			Auf mobile öffnen

Lieferstatus:	Auf Bestellung (Lieferzeit unbekannt)
Veröffentlichung:	Dezember 2016
Genre:	Naturwissensch., Medizin, Technik
	B / Circuits and Systems / Electronic circuits / Electronic Circuits and Systems / Electronic devices & materials / Electronic materials / Electronics / Electronics and Microelectronics, Instrumentation / Electronics# circuits & components / engineering / Metallic Materials / Metals / Metals and Alloys / Metals technology / metallurgy / Microelectronics / Microsystems and MEMS / Nanotechnology / Nanotechnology and Microengineering / Optical and Electronic Materials / Optical Materials / Other manufacturing technologies mehr...
ISBN:	9783319450971
EAN-Code:	9783319450971
Verlag:	Springer EN
Einband:	Gebunden
Sprache:	English
Dimensionen:	H 235 mm / B 155 mm / D
Gewicht:	15893 gr
Seiten:	969
Illustration:	XVI, 969 p. 700 illus., 440 illus. in color., farbige Illustrationen, schwarz-weiss Illustrationen
Zus. Info:	EUDR exemption - product or manufacturing materials placed on the market prior to 31.12.2025.
Bewertung:	Titel bewerten / Meinung schreiben

Inhalt:

This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.