Übersicht			Auf mobile öffnen

Lieferstatus:	i.d.R. innert 7-14 Tagen versandfertig
Veröffentlichung:	April 2026
Genre:	EDV / Informatik
	3D display / COMPUTERS / General / Holography / three-dimensional image processing
ISBN:	9783725873043
EAN-Code:	9783725873043
Verlag:	Mdpi Ag
Einband:	Gebunden
Sprache:	English
Dimensionen:	H 250 mm / B 175 mm / D 16 mm
Gewicht:	635 gr
Seiten:	174
Bewertung:	Titel bewerten / Meinung schreiben

Inhalt:

This Reprint features nine peer-reviewed open-access articles from Electronics' special issue on the interdisciplinary synergy of artificial intelligence, computer vision, and 3D display technologies, curated by leading experts in holography, AI, 3D imaging and optical signal processing. It advances theoretical and practical applications across core domains including holographic display, 3D quality inspection, AI-driven imaging, and edge computer vision, bridging academia and industry with solutions to real-world technical challenges. Highlighted research includes a noise-resilient edge-based masked face detection framework with 30% higher precision under severe Gaussian noise and improved throughput; a 3D mold manufacturing inspection system delivering 99% classification accuracy with minimal training data, outperforming deep learning models; and an end-to-end camera pose estimation method with 16% better pose and nearly 30% higher translation accuracy than conventional approaches.