Übersicht			Auf mobile öffnen

Lieferstatus:	Auf Bestellung (Lieferzeit unbekannt)
Veröffentlichung:	März 2017
Genre:	Naturwissensch., Medizin, Technik
	B / Circuits and Systems / Computer architecture & logic design / Electronic circuits / Electronic Circuits and Systems / engineering / Logic Design / Microprocessors / Processor Architectures mehr...
ISBN:	9783319547138
EAN-Code:	9783319547138
Verlag:	Springer EN
Einband:	Gebunden
Sprache:	English
Dimensionen:	H 235 mm / B 155 mm / D
Gewicht:	4203 gr
Seiten:	182
Illustration:	XIV, 182 p. 118 illus., 102 illus. in color., farbige Illustrationen, schwarz-weiss Illustrationen
Zus. Info:	EUDR exemption - product or manufacturing materials placed on the market prior to 31.12.2025.
Bewertung:	Titel bewerten / Meinung schreiben

Inhalt:

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.