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Autor(en): 
  • Mirko Scholz
  • Vladislav Vashchenko
  • System Level ESD Protection 
     

    (Buch)
    Dieser Artikel gilt, aufgrund seiner Grösse, beim Versand als 3 Artikel!


    Übersicht

    Auf mobile öffnen
     
    Lieferstatus:   Auf Bestellung (Lieferzeit unbekannt)
    Veröffentlichung:  April 2014  
    Genre:  Naturwissensch., Medizin, Technik 
     
    B / Circuits and Systems / Electronic circuits / Electronic Circuits and Devices / Electronic Circuits and Systems / Electronic devices & materials / Electronics / Electronics and Microelectronics, Instrumentation
    ISBN:  9783319032207 
    EAN-Code: 
    9783319032207 
    Verlag:  Springer EN 
    Einband:  Gebunden  
    Sprache:  English  
    Dimensionen:  H 235 mm / B 155 mm / D  
    Gewicht:  6328 gr 
    Seiten:  320 
    Illustration:  XVIII, 320 p. 295 illus., 12 illus. in color., farbige Illustrationen, schwarz-weiss Illustrationen 
    Zus. Info:  EUDR exemption - product or manufacturing materials placed on the market prior to 31.12.2025. 
    Bewertung: Titel bewerten / Meinung schreiben
    Inhalt:

    This book addresses key aspects of analog integrated circuits and systems design related to system level electrostatic discharge (ESD) protection.  It is an invaluable reference for anyone developing systems-on-chip (SoC) and systems-on-package (SoP), integrated with system-level ESD protection. The book focuses on both the design of semiconductor integrated circuit (IC) components with embedded, on-chip system level protection and IC-system co-design. The readers will be enabled to bring the system level ESD protection solutions to the level of integrated circuits, thereby reducing or completely eliminating the need for additional, discrete components on the printed circuit board (PCB) and meeting system-level ESD requirements. The authors take a systematic approach, based on IC-system ESD protection co-design. A detailed description of the available IC-level ESD testing methods is provided, together with a discussion of the correlation between IC-level and system-level ESD testing methods. The IC-level ESD protection design is demonstrated with representative case studies which are analyzed with various numerical simulations and ESD testing. The overall methodology for IC-system ESD co-design is presented as a step-by-step procedure that involves both ESD testing and numerical simulations.
     
    . Provides a systematic approach for on-chip ESD protection design for system-level IC pins;
    . Describes a system-level co-design methodology, which uses external system level ESD protection components, together with on-chip ESD protection structure;
    . Includes a comprehensive description of wafer- level and component-level test methodologies and numerical simulations.
      



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