Übersicht			Auf mobile öffnen

Lieferstatus:	Auf Bestellung (Lieferzeit unbekannt)
Veröffentlichung:	November 2012
Genre:	Naturwissensch., Medizin, Technik
	Artificial Intelligence / C / Computational Intelligence / Computer Modelling / Computer modelling & simulation / Computer simulation / Computermodellierung und -simulation / Electronic devices & materials / Electronic materials / Electronics / Electronics and Microelectronics, Instrumentation / engineering / Künstliche Intelligenz / Microelectronics / Nanotechnologie / Nanotechnology / Optical and Electronic Materials / Optical Materials / Simulation and Modeling mehr...
ISBN:	9783709172124
EAN-Code:	9783709172124
Verlag:	Springer EN
Einband:	Kartoniert
Sprache:	English
Dimensionen:	H 235 mm / B 155 mm / D
Gewicht:	598 gr
Seiten:	379
Illustration:	XII, 379 p.
Zus. Info:	EUDR exemption - product or manufacturing materials placed on the market prior to 31.12.2025.
Bewertung:	Titel bewerten / Meinung schreiben

Inhalt:

This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004. The conference program included 7 invited plenary lectures and 82 contributed papers for oral or poster presentation, which were carefully selected out of a total of 151 abstracts submitted from 14 countries around the world. Like the previous meetings, SISPAD 2004 provided a world-wide forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance. The variety of topics covered by the conference contributions reflects the physical effects and technological problems encountered in consequence of the progressively shrinking device dimensions and the ever-growing complexity in device technology.