SFr. 134.00
€ 144.72
BTC 0.0024
LTC 2.151
ETH 0.0462


bestellen

Artikel-Nr. 4700112


Diesen Artikel in meine
Wunschliste
Diesen Artikel
weiterempfehlen
Diesen Preis
beobachten

Weitersagen:



Autor(en): 
  • Toh-Ming Lu
  • Edward V. Barnat
  • Pulsed and Pulsed Bias Sputtering: Principles and Applications 
     

    (Buch)
    Dieser Artikel gilt, aufgrund seiner Grösse, beim Versand als 2 Artikel!


    Übersicht

    Auf mobile öffnen
     
    Lieferstatus:   i.d.R. innert 14-24 Tagen versandfertig
    Veröffentlichung:  September 2003  
    Genre:  Naturwissensch., Medizin, Technik 
    ISBN:  9781402075438 
    EAN-Code: 
    9781402075438 
    Verlag:  Springer Us 
    Einband:  Gebunden  
    Sprache:  English  
    Dimensionen:  H 241 mm / B 160 mm / D 15 mm 
    Gewicht:  442 gr 
    Seiten:  180 
    Zus. Info:  HC runder Rücken kaschiert 
    Bewertung: Titel bewerten / Meinung schreiben
    Inhalt:
    Diffusion Barrier Stack - 5 nm -3 nm -2 nm :. . . -. . . . : . . O. 21-lm Figure 2: Schematic representing a cross-sectional view of the topography that is encountered in the processing of integrated circuits. (Not to scale) these sub-micron sized features is depicted in Fig. 2. The role of the diffusion barrier is to prevent the diffusion of metallic ions into the interlayer dielectric (lLD). Depending on the technology, in particular the choice of the ILD and the metal interconnect, the diffusion barrier may be Ti, Ta, TiN, TaN, or a multi-layered structure of these materials. The adhesion of the barrier to the dielectric, the conformality of the barrier to the feature, the physical structure of the film, and the chemical composition of the film are key issues that are determined in part by the nature of the deposition process. Likewise, after the growth of the barrier, a conducting layer (the seed layer) is needed for subsequent filling of the trench by electrochemical deposition. Again, the growth process must be able to deposit a film that is continuous along the topography of the sub-micron sized features. Other factors of concern are the purity and the texture of the seed layer, as both of these factors influence the final resistivity of the metallic interconnect. Sputter-deposited coatings are also commonly employed for their electro-optical properties. For example, an electrochromic glazing is used to control the flux of light that is transmitted through a glazed material.
      
     Empfehlungen... 
     Pulsed and Pulsed Bias Sputtering: Principles and - (Buch)
     Weitersuchen in   DVD/FILME   CDS   GAMES   BÜCHERN   



    Wird aktuell angeschaut...
     

    Zurück zur letzten Ansicht


    AGB | Datenschutzerklärung | Mein Konto | Impressum | Partnerprogramm
    Newsletter | 1Advd.ch RSS News-Feed Newsfeed | 1Advd.ch Facebook-Page Facebook | 1Advd.ch Twitter-Page Twitter
    Forbidden Planet AG © 1999-2024
    Alle Angaben ohne Gewähr
     
    SUCHEN

     
     Kategorien
    Im Sortiment stöbern
    Genres
    Hörbücher
    Aktionen
     Infos
    Mein Konto
    Warenkorb
    Meine Wunschliste
     Kundenservice
    Recherchedienst
    Fragen / AGB / Kontakt
    Partnerprogramm
    Impressum
    © by Forbidden Planet AG 1999-2024
    Jetzt auch mit LiteCoin bestellen!