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Autor(en): 
  • Rao Tummala
  • Eugene J. Rymaszewski
  • Alan G. Klopfenstein
  • Microelectronics Packaging Handbook: Technology Drivers Part I 
     

    (Buch)
    Dieser Artikel gilt, aufgrund seiner Grösse, beim Versand als 3 Artikel!


    Übersicht

    Auf mobile öffnen
     
    Lieferstatus:   i.d.R. innert 14-24 Tagen versandfertig
    Veröffentlichung:  Januar 1997  
    Genre:  Naturwissensch., Medizin, Technik 
     
    TECHNOLOGY & ENGINEERING / Electrical / TECHNOLOGY & ENGINEERING / Electronics / Microelectronics / TECHNOLOGY & ENGINEERING / Industrial Design / Packaging
    ISBN:  9780412084317 
    EAN-Code: 
    9780412084317 
    Verlag:  Springer Nature B.V. 
    Einband:  Gebunden  
    Sprache:  English  
    Dimensionen:  H 235 mm / B 162 mm / D 46 mm 
    Gewicht:  1089 gr 
    Seiten:  752 
    Bewertung: Titel bewerten / Meinung schreiben
    Inhalt:
    Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool­ ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

      



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