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Autor(en): 
  • Das Shuvra
  • Mechatronic Modeling and Simulation Using Bond Graphs 
     

    (Buch)
    Dieser Artikel gilt, aufgrund seiner Grösse, beim Versand als 3 Artikel!


    Übersicht

    Auf mobile öffnen
     
    Lieferstatus:   Auf Bestellung (Lieferzeit unbekannt)
    Veröffentlichung:  März 2009  
    Genre:  Naturwissensch., Medizin, Technik 
     
    Energy, power generation, distribution and storage / engineering education resource / Instruments & instrumentation engineering / Instruments and instrumentation / multidisciplinary engineering / physical system analysis / Power generation & distribution / practical mechatronic simulation techniques
    ISBN:  9781420073140 
    EAN-Code: 
    9781420073140 
    Verlag:  Taylor and Francis 
    Einband:  Gebunden  
    Sprache:  English  
    Dimensionen:  H 234 mm / B 156 mm / D 29 mm 
    Gewicht:  1090 gr 
    Seiten:  504 
    Illustration:  schwarz-weiss Illustrationen 
    Bewertung: Titel bewerten / Meinung schreiben
    Inhalt:

    Bond graphs are especially well-suited for mechatronic systems, as engineering system modeling is best handled using a multidisciplinary approach. Bond graphing permits one to see the separate components of an engineering system as a unified whole, and allows these components to be categorized under a few generalized elements, even when they come from different disciplines. In addition to those advantages, the bond graph offers a visual representation of a system from which derivation of the governing equations is algorithmic. This makes the design process accessible to beginning readers, providing them with a practical understanding of mechatronic systems.

    Mechatronic Modeling and Simulation Using Bond Graphs is written for those who have some hands-on experience with mechatronic systems, enough to appreciate the value of computer modeling and simulation. Avoiding elaborate mathematical derivations and proofs, the book is written for modelers seeking practical results in addition to theoretical confirmations. Key concepts are revealed step-by-step, supported by the application of rudimentary examples that allow readers to develop confidence in their approach right from the start.

    For those who take the effort to master its application, the use of bond graph methodology in system modeling can be very satisfying in the way it unifies information garnered from different disciplines.

    In the second half of the book after readers have learned how to develop bond graph models, the author provides simulation results for engineering examples that encourage readers to model, simulate, and practice as they progress through the chapters. Although the models can be simulated using any number of software tools, the text employs 20Sim for all the simulation work in this text. A free version of the software can be downloaded from the 20Sim Web site.

      



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