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Artikel-Nr. 16809933


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Autor(en): 
  • Sandeep Kumar Shukla
  • Gaurav Singh
  • Low Power Hardware Synthesis from Concurrent Action-Oriented Specifications 
     

    (Buch)
    Dieser Artikel gilt, aufgrund seiner Grösse, beim Versand als 3 Artikel!


    Übersicht

    Auf mobile öffnen
     
    Lieferstatus:   i.d.R. innert 7-14 Tagen versandfertig
    Veröffentlichung:  September 2014  
    Genre:  Naturwissensch., Medizin, Technik 
     
    B / Circuits and Systems / Computer-Aided Design (CAD) / Computer-aided engineering / Computer-Aided Engineering (CAD, CAE) and Design / Electronic circuits / Electronic Circuits and Systems / engineering
    ISBN:  9781489987020 
    EAN-Code: 
    9781489987020 
    Verlag:  Springer EN 
    Einband:  Kartoniert  
    Sprache:  English  
    Dimensionen:  H 235 mm / B 155 mm / D  
    Gewicht:  291 gr 
    Seiten:  154 
    Illustration:  XXX, 154 p. 
    Zus. Info:  EUDR exemption - product or manufacturing materials placed on the market prior to 31.12.2025. 
    Bewertung: Titel bewerten / Meinung schreiben
    Inhalt:
    Human lives are getting increasingly entangled with technology, especially comp- ing and electronics. At each step we take, especially in a developing world, we are dependent on various gadgets such as cell phones, handheld PDAs, netbooks, me- cal prosthetic devices, and medical measurement devices (e.g., blood pressure m- itors, glucometers). Two important design constraints for such consumer electronics are their form factor and battery life. This translates to the requirements of reduction in the die area and reduced power consumption for the semiconductor chips that go inside these gadgets. Performance is also important, as increasingly sophisticated applications run on these devices, and many of them require fast response time. The form factor of such electronics goods depends not only on the overall area of the chips inside them but also on the packaging, which depends on thermal ch- acteristics. Thermal characteristics in turn depend on peak power signature of the chips. As a result, while the overall energy usage reduction increases battery life, peak power reduction in?uences the form factor. One more important aspect of these electronic equipments is that every 6 months or so, a newer feature needs to be added to keep ahead of the market competition, and hence new designs have to be completed with these new features, better form factor, battery life, and performance every few months. This extreme pressure on the time to market is another force that drives the innovations in design automation of semiconductor chips.
      



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