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Autor(en): 
  • Bruno Zatt
  • Luciano Agostini
  • Vladimir Afonso
  • Murilo Perleberg
  • Marcelo Porto
  • Altamiro Susin
  • Hardware Design for 3D Video Coding: Energy-efficient and High-throughput Architectures for Multiview Plus Depth Video Content 
     

    (Buch)
    Dieser Artikel gilt, aufgrund seiner Grösse, beim Versand als 3 Artikel!


    Übersicht

    Auf mobile öffnen
     
    Lieferstatus:   Auf Bestellung (Lieferzeit unbekannt)
    Veröffentlichung:  Februar 2025  
    Genre:  Naturwissensch., Medizin, Technik 
     
    Electronics Design and Verification / Embedded Systems / HEVC / High Efficiency Video Coding / Logic Design / MPEG Immersive Video / Multiview Video plus Depth / Rechnerarchitektur und Logik-Entwurf
    ISBN:  9783031802317 
    EAN-Code: 
    9783031802317 
    Verlag:  Springer International Publishing 
    Einband:  Gebunden  
    Sprache:  English  
    Dimensionen:  H 240 mm / B 168 mm / D  
    Seiten:  218 
    Illustration:  XXX, 218 p. 109 illus., 101 illus. in color., schwarz-weiss Illustrationen, farbige Illustrationen 
    Zus. Info:  EUDR exemption - product or manufacturing materials placed on the market prior to 31.12.2025. 
    Bewertung: Titel bewerten / Meinung schreiben
    Inhalt:
    This book focuses on the research and development challenges posed by 3D video systems based on multi-view plus depth (MVD) technology. This technology can produce a realistic immersive experience generating synthetic video views on the decoder side, reducing the amount of information on the encoder side. The discussion presented in this book explores the MVD characteristics to propose high-throughput and energy-efficient architectures/systems, focusing on 3D-HEVC, the state-of-the-art standard for exploiting the MVD concept. The book includes an extensive discussion of the 3D-HEVC video encoding, followed by an in-depth evaluation of the 3D-HEVC reference software behavior. Then, the book presents in detail a set of high-throughput and energy-efficient architectures targeting the three main prediction steps inside the 3D-HEVC: intra-frame prediction, inter-frame prediction, and inter-view prediction.

    In addition, this book includes:

    • Provides a detailed description of the new MVD encoding tools used in 3D-HEVC.
    • Offers an overview of state-of-the-art works on MVD hardware architectures.
    • Includes high-throughput architectures for inter-prediction focused on Inter-frames and Inter-view predictions.
      



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