Übersicht			Auf mobile öffnen

Lieferstatus:	i.d.R. innert 5-10 Tagen versandfertig
Veröffentlichung:	Oktober 2011
Genre:	Naturwissensch., Medizin, Technik
	Circuit / Development / electricaloverstress(EOS) / Electronics / HEAT / Material / Mathematik und Naturwissenschaften / Photon
ISBN:	9789401066815
EAN-Code:	9789401066815
Verlag:	Springer
Einband:	Kartoniert
Sprache:	English
Dimensionen:	H 229 mm / B 152 mm / D 26 mm
Gewicht:	678 gr
Seiten:	472
Bewertung:	Titel bewerten / Meinung schreiben

Inhalt:

Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.