|
|
|
Electronic Packaging Materials and Their Properties
|
(Buch) |
Dieser Artikel gilt, aufgrund seiner Grösse, beim Versand als 3 Artikel!
| Inhalt: |
| Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders. |
|
Auf Bestellung (Lieferzeit unbekannt)
Newsfeed | 
Facebook | 
Twitter
