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Autor(en): 
  • Richard C. Bradt
  • Richard E. Tressler
  • Deformation of Ceramic Materials II 
     

    (Buch)
    Dieser Artikel gilt, aufgrund seiner Grösse, beim Versand als 3 Artikel!


    Übersicht

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    Lieferstatus:   i.d.R. innert 7-14 Tagen versandfertig
    Veröffentlichung:  November 2012  
    Genre:  Naturwissensch., Medizin, Technik 
    ISBN:  9781461568049 
    EAN-Code: 
    9781461568049 
    Verlag:  Springer Us 
    Einband:  Kartoniert  
    Sprache:  English  
    Dimensionen:  H 254 mm / B 178 mm / D 41 mm 
    Gewicht:  1409 gr 
    Seiten:  764 
    Zus. Info:  Paperback 
    Bewertung: Titel bewerten / Meinung schreiben
    Inhalt:
    This volume "Deformation of Ceramic Materials II" constitutes the proceedings of an international symposium held at The Pennsyl­ vania State University, University Park, PA on July 20, 21, and 22, 1983. It includes studies of semiconductors and minerals which are closely related to ceramic materials. The initial conference on this topic was held in 1974 at Penn State and the proceedings were published in the volume entitled "Deformation of Ceramic Materials." This conference emphasized the deformation behavior of crystals and po1ycrysta11ine and polyphase ceramics with internationally recognized authorities as keynote lecturers on the major subtopics. Several papers dealing with cavity nucleation and creep crack growth represent a major new research thrust in ceramics since the first conference. This collection of papers represents the state-of-the art of our understanding of the plastic deformation behavior of ceramics and the crystals of which they are composed. We are grateful for the suggestions of our International Advisory Committee .in recommending experts in their respective countries to participate. We are particularly grateful that the organizers of the previous Dislocation-Point Defect Interaction Workshops agreed to participate in the Penn State Symposium as an alternative at the suggestion of Prof. A. H. Heuer. We acknowledge the financial support of the National Science Foundation for this conference.

      



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