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Autor(en): 
  • Bekir Sami Yilbas
  • The Laser Cutting Process: Analysis and Applications 
     

    (Buch)
    Dieser Artikel gilt, aufgrund seiner Grösse, beim Versand als 3 Artikel!


    Übersicht

    Auf mobile öffnen
     
    Lieferstatus:   Auf Bestellung
    Veröffentlichung:  November 2017  
    Genre:  Naturwissensch., Medizin, Technik 
    ISBN:  9780128129821 
    EAN-Code: 
    9780128129821 
    Verlag:  Elsevier 
    Einband:  Kartoniert  
    Sprache:  English  
    Dimensionen:  H 226 mm / B 150 mm / D 23 mm 
    Gewicht:  540 gr 
    Seiten:  328 
    Bewertung: Titel bewerten / Meinung schreiben
    Inhalt:
    Laser Cutting Process: Analysis and Applications presents a comprehensive understanding of the laser cutting process and its practical applications. The book includes modelling, such as thermal and stress analysis and lamp parameter analysis for kerf width predictions, and practical applications such as laser cutting of metallic and non-metallic materials and assessment of end product quality such as cutting quality. It provides detailed information and insight into the laser cutting process, analytical considerations for laser cutting, the importance of the affecting parameters, stress levels formed in the cutting section, cutting efficiency, and cut section morphology and metallurgy. In analytical and model studies, thermal analysis is considered while incorporating the following: i) moving source with presence of impinging jet, ii) thermal stress analysis leading to prediction of residual stresses, iii) kerf width predictions, and iv) molten flow in the kerf, and striations due to cutting instabilities. . . The practical applications include: cutting quality assessment via statistical methods; morphological changes, in particular, difficult to cut materials;oxidation reactions; andmetallurgy and fracture toughness assessments in the cutting section. Finally, limitations and further studies in laser cutting are discussed in the concluding section of the book. This book is designed to be used by individuals working in the area of laser machining and high energy processing.

      



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