Übersicht			Auf mobile öffnen

Lieferstatus:	Auf Bestellung (Lieferzeit unbekannt)
Veröffentlichung:	November 2010
Genre:	Naturwissensch., Medizin, Technik
	C / Electronic devices & materials / Electronic materials / Electronics / Electronics and Microelectronics, Instrumentation / engineering / Industrial and Production Engineering / Industrial safety / Metallic Materials / Metals / Metals and Alloys / Metals technology / metallurgy / Microelectronics / Optical and Electronic Materials / Optical Materials / quality control / Quality Control, Reliability, Safety and Risk / reliability / Reliability engineering mehr...
ISBN:	9781441946348
EAN-Code:	9781441946348
Verlag:	Springer EN
Einband:	Kartoniert
Sprache:	English
Dimensionen:	H 235 mm / B 155 mm / D
Gewicht:	326 gr
Seiten:	192
Illustration:	XVI, 192 p. 70 illus., schwarz-weiss Illustrationen
Zus. Info:	EUDR exemption - product or manufacturing materials placed on the market prior to 31.12.2025.
Bewertung:	Titel bewerten / Meinung schreiben

Inhalt:

Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.