Key features:

• describes how product robustness is proven by non-destructive stress margin analysis
• clearly delineates between accelerated ageing and accelerated life testing, and exposes the myth that all products must be treated as candidates for simultaneous multi-axis, multi-stress environmental forcing functions
• provides details of proven methodologies for the development and implementation of cost effective environmental stress screening programmes covering different levels of product assembly
• summarises other sources of environmental stress and their effect on product performance, robustness and ageing
• covers the physical concepts governing the response of electronic products to steady state temperature extremes, temperature cycling, thermal and mechanical shock, and vibration

With classroom tested material, this book contains mathematical models so readers may gain a thorough understanding of the mechanisms that contribute to the erosion of hardware, functional robustness and durability. Case studies and unique worked examples examine the physical properties of individual electronic hardware designs.

This reference text is for quality and reliability engineers, manufacturing process engineers, environmental test engineers and design engineers in domestic, commercial and military electronics industries. It will also be of interest to advanced electrical and electronic engineering students studying power systems or reliability technology courses, also production, project and procurement managers in telecommunications, automotive and aerospace industries.